The IR860 is a precision SMD/BGA Rework Station engineered for professional repair and assembly of surface-mount and BGA components. Featuring dual heating capabilities (150W infrared top heater and 650W bottom heater), it delivers uniform heat distribution ideal for lead-free reflow and complex multilayer PCB rework.
With a temperature range of 45°C to 350°C, the IR860 supports controlled and safe rework operations. The infrared heating technology ensures contactless heating, reducing the risk of thermal shock and damage to adjacent components. The ESD-safe design, adjustable temperature profiles, and built-in digital controls make it suitable for high-precision rework in R&D labs, service centers, and manufacturing environments.
Key Features:
Heating Power: 150W (IR Top), 650W (Bottom Heater)
Temperature Range: 45°C – 350°C
Heating Type: Infrared (non-contact)
Design: ESD-safe for static-sensitive components
Applications: Ideal for BGA, QFN, CSP, SMD components reflow and repair
Control: Digital temperature setting with uniform heat distribution
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